LTCC (Low Temperature Co-fired Ceramics): Ceramic Substrate
Wafer-level Chip Size Package Substrate
Camera Module Substrate
RF Module Substrate
Interposer Substrate for Semiconductor Wafer Test
Radiograph of Stacked Via Holes (50 Layers, Via Dia. : 60µm)
Fine Pitch Pad Area
Min. Pad Pitch : Around 200µm
HTC (High Temperature Fired Ceramics): Ceramic Antenna
Patch Antenna for GPS/SDARS
Chip Antenna for Blue tooth/W-LAN
