HomeProductsAdvanced DevicesLTCC Applied Devices

LTCC Applied Devices

1. LTCC (Low Temperature Co-fired Ceramics) Design Guideline

2. LTCC: Ceramic Substrate

12 inch Interposer Substrate for Memory (Internal Power Supply & Ground)

  • Internal wiring is available

LTCC Substrate for RF

  • Dielectric Material for high frequency wave (εγ:50)
    Self-developed material: YDM-500 (US PAT No.7781359)

Wafer-level Chip Package Substrate

  • Dielectric Material for high frequency wave (εγ:20)
    Self-developed material: YDM-200

LED LTCC Substrate

  • High reflectance material
  • High heat dissipation
  • Excellent mountability due to its superior flatness

Backlight LED Multiple LTCC Package

  • LTCC Integral Structure
  • The light that is more uniform than a package type

Interposer Substrate for Logic (Multi Pin & Dut)

 

LTCC Package for IC

 

LED Super-Thin LTCC for CSP Substrate

  • Thickness : 0.075~0.150mm

Substrate for RF Module

  • Dimensions of product: 3.35.10.5mm
  • Printed Resistor: 1Ω~10MΩ

Interposer Substrate for Semiconductor Wafer Test

LTCC Interposer Substrate

Enlarged DUT Pattern

Radiograph of Stacked Via Holes (50 Layers, Via Dia. : 55µm)

Fine Pitch Pad Area
Min. Pad Pitch : Around 120µm