1. LTCC (Low Temperature Co-fired Ceramics) Design Guideline
2. LTCC: Ceramic Substrate
LTCC Substrate for RF
- Dielectric Material for high frequency wave (εγ:50)
Self-developed material: YDM-500 (US PAT No.7781359)
Wafer-level Chip Package Substrate
- Dielectric Material for high frequency wave (εγ:20)
Self-developed material: YDM-200
Camera Module Substrate
Substrate for Quartz Crystal Oscillator Module
- Dimensions of product: 3.3×5.1×0.5mm
- Dimensional Accuracy: 0.05%
Interposer Substrate for Semiconductor Wafer Test
Radiograph of Stacked Via Holes (50 Layers, Via Dia. : 60µm)
Fine Pitch Pad Area
Min. Pad Pitch : Around 200µm
3. HTC (High Temperature Fired Ceramics): Ceramic Antenna
Patch Antenna for GPS/SDARS
Chip Antenna for Blue tooth/W-LAN
