New solutions harnessing ceramic and RF technology
Yokowo’s ceramic substrates, sold the world over
Based on low temperature co-fired ceramic (LTCC) and high-temperature fired ceramic (HTC) technologies, Yokowo offers compact, low-profile ceramic substrates and compact that enable high density wiring for use in the consumer sector, particularly cellular phones.
Ceramic Substrate
Substrates for use in the wafer level CSP and camera module sector increasingly require high-density, high-precision pattern formation and flatness. Yokowo harnesses cutting-edge LTCC processing technology and 3D RF design technology to offer its customers products that meet their needs precisely.
3-D RF Design
Using a circuit and electromagnetic field simulator, Ansoft Designer and HFSS, Yokowo provides circuit design and three-dimensional RF design for antennas, filters, RF module substrates and others.
Interposer Substrate for Semiconductor Wafer Test
An LSI semiconductor wafer can have thousands of densely aligned bonding pads. LSI testing cannot be performed without a prober for physically expanding the narrow pitch pads of the semiconductor to connect them to the tester. Based on its advanced LTCC processing technology, Yokowo has successfully developed an interposer substrate that plays a central role in the prober. Together with its vertical micro precision probe, Yokowo will respond to sophisticated demand from the semiconductor wafer sector.
YOKOWO Advanced Device Center
The Yokowo Advanced Device Center was set up in Tomioka, Gumma Prefecture as a base for the mass production of LTCC products and for developing and prototyping advanced LTCC technologies. With LTCC material development and process technology development, it offers advanced LTCC products and an excellent technical environment.
