Yokowo Co., Ltd.

Technology

Ceramic Technology

Ambitious goals constantly focused on the next generation.
Tireless pursuit of world-leading LTCC technology.

Thanks to its LTCC (low-temperature co-fired ceramics) technology, Yokowo is working on the development of high-performance substrate products that harness high-precision Via formation technology and pattern printing lamination technology to meet compact and high density wiring requirements. Yokowo has also made it possible to integrate RF circuits by combining RF design technology perfected over many years.

Evolving Fine Pitch and Multi Layers Technology to the Future

  • Wiring Lines (Line/Space=50/50μm)Wiring Lines (Line/Space=50/50μm)
  • Fine Pitched Pads (150μm)Fine Pitched Pads (150μm)
  • Radiograph of Stacked Via Holes (50 Layers, Via Dia. : 50μm)Radiograph of Stacked Via Holes (50 Layers, Via Dia. : 50μm)
  • Enlarged DUT PatternEnlarged DUT Pattern
PROBE-CARD Structure

PROBE-CARD Structure

Camber Restraining Technology for Ultra Thin Substrate

Camber Restraining Technology for Ultra Thin Substrate
Dimension:100mm dia., 0.2mm Thickness, (3 Layers)

Whole Process, from Circuit Design to Mass Production, Available

  1. Design
    3-D Circuit and Electromagnetic Simulation
    Circuit and Wiring Design(3-D RF Circuit Available)
    Material Design
  2. Trial Manufacture
    Advanced Device Center
  3. Evaluation
    Performance Evaluation
    Reliability Test
  4. Mass Production
    Advanced Device Center